Available for bidding is a Westech automatic wafer polishing machine model 372. Full functionality is unknown but the machine was in working condition when decommissioned in 2006. So this equipment is being sold "as is/where is".

The Model 372 wafer polisher is a fully automated, single sided dual process, cassette to cassette polishing system. The Model 372 polishes wafers with diameters of 4"-8". Wafer specifications and total wafer processing times are enhanced by dual polishing stations. The primary station performs the material removal while the secondary station provides the final polishing step. The wafers are transported using a vacuum chuck and water track. The Model 370 series polishers provide increased yields by consistent application of a programmed automated process.

FEATURES:
Cassette-input, cassette- output with full automation of the polishing process.

The wafer chuck is scrubbed prior to picking up each wafer at the input station.

Independent, programmable parameters for polishing at both the primary and secondary stations.

Polished wafers are stored under water to ensure easy to clean surfaces.
Waxless process.

Can be used to polish wafers with a flatness of two microns or better, 2 sigma value for 5 inch wafers.

Temperatures and pressures are controlled during the polishing cycle to ensure consistent results.

Can be used to planarize interlayer dielectrics in device structures and polish Si, Ge, GaAs.

Dual slurry systems. Additional slurry pumps optional.

Can be used for yield enhancement by buff polishing problem surfaces.

Variable speed spindle drives on both primary and final stations.
Temperature controlled platens optional.

SPECIFICATIONS:

POWER:460 VAC +/- 10%, 40 amps, 3 phase, 60 hertz.

DI WATER: 30 gpm.(119 liters/hr)30 psi minimum,50 psi maximum,45 psi preferred.
Minimum quality must conform to ASTM D-119377

RAW WATER: Peak flow of 555 gph Average flow of 10-25 gph 40 psi minimum, 70 psi maximum, 60 psi preferred.

AIR:1 SCFM (28 SLM)50 psi minimum, 100 psi maximum, 85 psi preferred

DRY NITROGEN:1 SCFM (28 SLM)30 psi minimum, 100 psi maximum, 40 psi preferred

DIMENSIONS: 66" Wide, 77" Deep, 74" High.

WEIGHT: 6,200 pounds

EXTRAS: (2) 45 gallon containers of
polishing fluid

This item is offered for local pickup only. It is up to the winning bidder to arrange all shipping. Loading assistance is available on site.

 

Condition:  SEE DESCRIPTION